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Pastes
The Putty Silicone Thermal Pads are an appropriate solution for your heat transfer issues where compression rates are very low: they change its shape to compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow.
These pads are available in sheets or in pieces cut according to your drawings. These pads exist with a thermal conductivity from 6 to 17W/m°K, in several thicknesses. They are naturally tacky.
The Dispensing Thermal Pastes are an appropriate solution for your heat transfer issues where compression rates are very low: they change its shape to compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow.
They are available in 30cc tubes and in 330cc cartridges. Their thermal conductivity is 1.5 or 3W/m°K.