Compelma

The Standard Silicone Thermal Pads are an appropriate solution for heat transfer: they compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow. These pads are available in sheets or in pieces cut according to your drawings. These pads exist with a thermal conductivity from 1.5 to 3W/m°K, inseveral thicknesses. They are naturally tacky, and can be hardened on one face for a better handeling, or fiber reinforced in their thickness for thin versions.
Moreover, these standard thermal pads have a damping vibration property.

The Soft Silicone Thermal Pads are an appropriate solution for heat transfer: they compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow. They need a low compression rate due to their softness.
These pads are available in sheets or in pieces cut according to your drawings. These pads exist with a thermal conductivity from 1.3 to 2.9W/m°K, in several thicknesses. They are naturally tacky, and can be hardened on one face for a better handeling, or fiber reinforced in their thickness for thin versions.
Moreover, these standard thermal pads have a damping vibration property.

The High Perfomance Silicone Thermal Pads are an appropriate solution for the most demanding heat transfer issues: they compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow.
These pads are available in sheets or in pieces cut according to your drawings. These pads exist with a thermal conductivity from 6 to 11W/m°K, in several thicknesses. They are naturally tacky, and can be hardened on one face for a better handeling, or fiber reinforced in their thickness for thin versions.
Moreover, these standard thermal pads have a damping vibration property.

The Putty Silicone Thermal Pads are an appropriate solution for your heat transfer issues where compression rates are very low: they change its shape to compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow.
These pads are available in sheets or in pieces cut according to your drawings. These pads exist with a thermal conductivity from 6 to 17W/m°K, in several thicknesses. They are naturally tacky.

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The Standard Siliconefree Thermal Pads are an appropriate solution for heat transfer for clean applications where Silicone materials are forbidden (optics, wafer...): they compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow. These pads are available in sheets or in pieces cut according to your drawings. These pads exist with a 1.5W/m°K thermal conductivity, in several thicknesses. They are naturally tacky, and can be hardened on one face for a better handeling, or fiber reinforced in their thickness for thin versions.
Moreover, these standard thermal pads have a damping vibration property.

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The Dispensing Thermal Pastes are an appropriate solution for your heat transfer issues where compression rates are very low: they change its shape to compensate the contact unevenness between your electronic devices and your chassis in order to minimize the thermal resistance and to ensure the heat transfer flow.
They are available in 30cc tubes and in 330cc cartridges. Their thermal conductivity is 1.5 or 3W/m°K.