Thermal interfaces materials
Our thermal interface materials transfer heat from a hot to a cold point. They remove the air zones between the hot surface of a component and the heatsink. They are cut according to your drawings and they are available in sheets or rolls depending on their dimensions.
Our range consists of three main families: silicone base, silicone free and graphite.
- Silicone base Ultra Soft with a thermal conductivity ≤ 17w/m.K
These interfaces are produced by a polymer matrix charged with thermal conductive particles. They adapt themselves to component’s reliefs on a PCB.
Available charges: Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver…
- Silicone free with a thermal conductivity ≤ 3W/m.K
These interfaces have similar functions to the silicone interfaces but they don’t present any risk of outgassing and bleeding oil in sensitive environments (hard disks, optical components, etc).
- Graphite base with thermal conductivity ≤1500 W/m.K in X,Y plane
These interfaces are available in naturally. They are also developed in synthetic version in order to obtain a better arrangement of the layers of graphene (gain in flexibility and solidity). These interfaces can be formed for fine thicknesses (some tenth of millimeters max). They can be laminated to metallic parts (Copper or Aluminum) to increase the thermal performances of the assembly).
For more information, please visit our partner FUJIPOLY website for their SARCON® product line.