Catalogue of Thermal Interface Materials (Fujipoly)

Custom Cut and References on Demand

About Thermal Interface Materials (Fujipoly):
The range of thermal interface materials is really large. There is plenty of providers and manufacturers with different levels of quality and performance on the market. We have associated with Fujipoly in order to propose a high quality level to our customers. The thermal interface materials manufactured by Fujipoly have proved successful in many projects in different fields (medical, industrial, military, aeronautical, automotive).
Compelma use this thermal material as raw material to propose custom made thermal interfaces. We die cut your thermal interfaces following your drawings.
Our thermal engineer have an extensive background in the choice of thermal material depending the project. We are pleased to advise you and to propose the most efficient product for your project. You can also consult our article: how to choose the best thermal interface material.

For any further information and advices, please contact our team using the tchat or by mail using our contact form.

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GR80A

Standard Gap Filler (Silicone Thermal Interface)

GR80A

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

8.0
0.3 to 3.0mm
75

Operating Temp. (°C)

-40°C to +150°C
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PG80A

Soft Gap Filler (Silicone Thermal Interface)

PG80A

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

8.0
0.5 to 2.0mm

Operating Temp. (°C)

-40°C to +150°C
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SPG50B

Form In Place (Silicone Thermal Interface)

SPG50B

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

5.0

Operating Temp. (°C)

-40°C to +150°C
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GR45A

Standard Gap Filler (Silicone Thermal Interface)

GR45A

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

4.5
0.5 to 5.0mm
50

Operating Temp. (°C)

-40°C to +150°C
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SPG30B

Form In Place (Silicone Thermal Interface)

SPG30B

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

3.1

Operating Temp. (°C)

-40°C to +150°C
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GR25A

Standard Gap Filler (Silicone Thermal Interface)

GR25A

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

2.5
0.5 to 5.0mm
50

Operating Temp. (°C)

-40°C to +150°C
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PG25A

Soft Gap Filler (Silicone Thermal Interface)

PG25A

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

2.5
1.5 to 5.0mm

Operating Temp. (°C)

-40°C to +150°C
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SPG20B

Form In Place (Silicone Thermal Interface)

SPG20B

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

2.1

Operating Temp. (°C)

-40°C to +150°C
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NR-c

Gap Filler (Non-Silicone Thermal Interface)

NR-c

Thermal Conductivity (W/m.K):

Thickness (mm):

Hardness (Shore 00):

1.3
0.3 to 3.0
53

Operating Temp. (°C)

-40°C to +150°C
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