Thermal paste and thermal dispensing (for CPU, GPU)

High performance thermal paste for thermal dissipation (on PCB, CPU, GPU).

High performance thermal paste for thermal dissipation (on PCB, CPU, GPU).
Catalogue en ligneSpécifications (PDF)Catalogue (PDF)
Dernière mise à jour :
8/2/2022
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
No items found.
Matériaux
Loaded silicone, different viscosities and thermal conductivities on request.
Procédés de Fabrication
Silicone mixed with thermal conductive particules (metal or ceramic)
Charge disponible:
Conductivité:
Prototypage:
Perfect for prototype stage.
Dureté:
Options
Supply of only material (syringe, pot, cartridge).
Packaging
Syringes (to apply by hand) or automatic dispense on the equipment by our programmable robot.
Un projet, une demande ?

Description

These thermal pastes are used for high technology projects with a high thermal conductivity expected (telecom, military, medical).

This high-performance product ensures an interface between CPU, GPU, other processors and the heatsink.

Thermal paste is directly dispensed on casting or PCB material for protection.

It can be used in syringe or dispensed using a technology digitally controlled 3 axes, which adapt dispensed thickness to accommodate the equipment topography.

This thermal paste is also used for overclocking CPU to ensure the best performances.

Un projet, une demande ?Retour aux produits

Nous proposons également :

Interface thermique (Fujipoly)

Dissipateur / radiateur thermique

Module thermo électrique à effet Peltier

Plaque froide pour la gestion thermique en électronique

Interface thermique ultra soft

Pâte thermique - Seringue et déposée (Dispensing)

Comment pouvons-nous vous aider ?

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High performance thermal paste for thermal dissipation (on PCB, CPU, GPU).
Online CatalogueDatasheet (PDF)Catalogue (PDF)
Last update:
February 8, 2022
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
Thermal interface material - paste - pate thermique - Compelma
No items found.
Materials
Loaded silicone, different viscosities and thermal conductivities on request.
Manufacturing process
Silicone mixed with thermal conductive particules (metal or ceramic)
Particle load
Prototyping
Perfect for prototype stage.
Conductivité:
Hardness
Options
Supply of only material (syringe, pot, cartridge).
Packaging
Syringes (to apply by hand) or automatic dispense on the equipment by our programmable robot.
Samples and Request

Description

These thermal pastes are used for high technology projects with a high thermal conductivity expected (telecom, military, medical).

This high-performance product ensures an interface between CPU, GPU, other processors and the heatsink.

Thermal paste is directly dispensed on casting or PCB material for protection.

It can be used in syringe or dispensed using a technology digitally controlled 3 axes, which adapt dispensed thickness to accommodate the equipment topography.

This thermal paste is also used for overclocking CPU to ensure the best performances.

A project, a request?Back to products

We also propose:

Thermal interface material (Fujipoly)

Thermal heatsink

Thermoelectrical cooler module – Peltier

Cold plates

Ultra Soft thermal interface (TIM)

Thermal paste and thermal dispensing (for CPU, GPU)

How can we help you?

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