Ultra Soft thermal interface (TIM)

Thermal Interface Material (TIM) used for high performance thermal dissipation. This Ultra Soft interface also protects the component from mechanical strength.

Matériaux
Silicone mixed with conductive particles
Procédés de Fabrication
Entire sheet or die cut (according to your drawing)
Charge disponible:
Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver
Conductivité:
≤ 17 W/m.K
Prototypage:
Ask for a custom cut for sample
Dureté:
< 25 Shore 00
Options
Fiber glass, Hardened side, thickness: ask us for your project
Packaging
Sheets or reels.
Un projet, une demande ?

Description

A thermal interface material transfers the heat from a hot to a cold point.

Its remove the air zones between the hot surface and the heatsink (air is insulating).

Ultra Soft thermal interfaces are produced by mixing a polymer material with thermal conductive particles (mostly metallic).

Its adapt to the reliefs of your electronic card (PCB) and fit your CPU and GPU.

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Materials
Silicone mixed with conductive particles
Manufacturing process
Entire sheet or die cut (according to your drawing)
Particle load
Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver
Prototyping
Ask for a custom cut for sample
Conductivité:
≤ 17 W/m.K
Hardness
< 25 Shore 00
Options
Fiber glass, Hardened side, thickness: ask us for your project
Packaging
Sheets or reels.
Samples and Request

Description

A thermal interface material transfers the heat from a hot to a cold point.

Its remove the air zones between the hot surface and the heatsink (air is insulating).

Ultra Soft thermal interfaces are produced by mixing a polymer material with thermal conductive particles (mostly metallic).

Its adapt to the reliefs of your electronic card (PCB) and fit your CPU and GPU.

How can we help you?

Thank you! Your submission has been received!
Oops! Something went wrong while submitting the form.