Thermal interface material (Fujipoly)

High performance thermal interface material (TIM). Compelma is the European representative of Fujipoly.

Matériaux
Silicone load with metallic particles (Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver) or ceramic particles
Procédés de Fabrication
Mixing silicone and particles then cut the sheets
Charge disponible:
Prototypage:
Die cutting or custom cut with xy cutting table
Conductivité:
≤ 17w/m.K
Dureté:
On request, depending of the material
Options
Adhesive, hardened side, fiberglass matrice
Packaging
Sheets or reel for automatic application.

Description

Interface thermique
Dissipateur
Peltiers

Thermal interfaces avoid air (insulator) between the heatsink and the CPU, GPU, processor. It creates a bridge between a hot and a cold point.

Performance depends of the particle charge into the silicone interface.

Complema is the European representative of Fujipoly. For more information, please visit our partner FUJIPOLY website for their SARCON® product line.

Thermal interfaces are cut according to your drawings and are available in sheets or rolls depending on their dimensions.

Our range consists of three main families: silicone base, silicone free and graphite.

  • Silicone base Ultra Soft with a thermal conductivity ≤ 17w/m.K These interfaces are produced by a polymer matrix charged with thermal conductive particles. They adapt themselves to component’s reliefs on a PCB.
  • Silicone free with a thermal conductivity ≤ 3W/m.K These interfaces have similar functions to the silicone interfaces but they don’t present any risk of outgassing and bleeding oil in sensitive environments (hard disks, optical components, etc.)
  • Graphite base with thermal conductivity ≤1500 W/m.K in X,Y planes These interfaces are available in naturally or synthetic (gain in flexibility and solidity). These interfaces can be formed for fine thicknesses (some tenth of millimetres max). They can be laminated to metallic parts (Copper or Aluminium) to increase the thermal performances of the assembly.

Contact us to get support to choose the best solution.

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Thermal interface material (Fujipoly)

High performance thermal interface material (TIM). Compelma is the European representative of Fujipoly.

Materials
Silicone load with metallic particles (Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver) or ceramic particles
Manufacturing process
Mixing silicone and particles then cut the sheets
Particle load
Prototyping
Die cutting or custom cut with xy cutting table
Conductivité:
≤ 17w/m.K
Hardness
On request, depending of the material
Options
Adhesive, hardened side, fiberglass matrice
Packaging
Sheets or reel for automatic application.

Description

Thermal interfaces avoid air (insulator) between the heatsink and the CPU, GPU, processor. It creates a bridge between a hot and a cold point.

Performance depends of the particle charge into the silicone interface.

Complema is the European representative of Fujipoly. For more information, please visit our partner FUJIPOLY website for their SARCON® product line.

Thermal interfaces are cut according to your drawings and are available in sheets or rolls depending on their dimensions.

Our range consists of three main families: silicone base, silicone free and graphite.

  • Silicone base Ultra Soft with a thermal conductivity ≤ 17w/m.K These interfaces are produced by a polymer matrix charged with thermal conductive particles. They adapt themselves to component’s reliefs on a PCB.
  • Silicone free with a thermal conductivity ≤ 3W/m.K These interfaces have similar functions to the silicone interfaces but they don’t present any risk of outgassing and bleeding oil in sensitive environments (hard disks, optical components, etc.)
  • Graphite base with thermal conductivity ≤1500 W/m.K in X,Y planes These interfaces are available in naturally or synthetic (gain in flexibility and solidity). These interfaces can be formed for fine thicknesses (some tenth of millimetres max). They can be laminated to metallic parts (Copper or Aluminium) to increase the thermal performances of the assembly.

Contact us to get support to choose the best solution.

Contact Us

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